Among others, you can find in the database »Fraunhofer-Publica« scientific publications, conference contributions and proceedings from the Fraunhofer institutes.
APECS Pilot Line starts Operation in the Framework of the EU Chips Act
The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semi-conductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act.
Paving the way for the semiconductor future: The Chiplet Center of Excellence commences operations
Three Fraunhofer Institutes have launched a forward-looking research initiative in Dresden: the Chiplet Center of Excellence (CCoE). Its purpose is to partner with industry to drive forward the introduction of chiplet technology.
New dual leadership at the Dresden branch of Fraunhofer IIS
For thirteen years, Professor Peter Schneider has been the head of the Engineering of Adaptive Systems EAS division, part of the Fraunhofer Institute for Integrated Circuits IIS. On January 1, 2024, he was joined by electrical engineer Dr Wolfgang Felber.
Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS