News

 

European Chiplet Innovation: APECS Pilot Line starts Operation

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. 

 

Paving the way for the semiconductor future: The Chiplet Center of Excellence commences operations

Three Fraunhofer Institutes have launched a forward-looking research initiative in Dresden: the Chiplet Center of Excellence (CCoE). Its purpose is to partner with industry to drive forward the introduction of chiplet technology.

 

embedded world from March 11-13, 2025

The embedded world exhibition and conference offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to complex system design. 

 

Chiplet Summit in Santa Clara on January 21-23, 2025

The must-attend event of the year for leaders and innovators across the entire chiplet ecosystem.

Fraunhofer Institute for Integrated Circuits IIS

Division Engineering of Adaptive Systems EAS

Muenchner Strasse 16
01187 Dresden, Germany
Phone +49 351 45691-0
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From our work

Getting started with artificial intelligence for SMEs

In business practice, AI is particularly valuable where traditional solutions are not efficient enough or have reached their limits. However, SMEs in particular often face major challenges when using AI.  

This is where the Application and Test Center AI (ATKI), which is currently being established at Fraunhofer IIS/EAS in Dresden, comes in. Its services are designed to help companies use AI profitably and thus secure competitive advantages. The center aims to lower barriers to entry and support the rapid implementation of solutions in practice.

Research Fab Microelectronics

Fraunhofer IIS/EAS is participant of the Research Fab Microelectronics Germany.

 

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