EAS Newsletter

The pilot line for »Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems« (APECS) has officially commenced operations. It marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act.

The search for suitable hardware for an AI application is often an expensive and time-consuming process. Now, a team from the Fraunhofer Institute for Integrated Circuits IIS in Dresden has developed a method that shows which AI runs more efficiently on which hardware. For example, this allows SMEs, industrial companies, building services companies, or building operators with wear-critical plant technology to minimize investment risks and downtime, guarantee process stability and operational reliability, and simultaneously reduce their energy consumption and costs. 

Microelectronics support the fight against climate change and for a better environment; for example, by intelligently controlling drive units, ensuring optimal operation of energy systems, and monitoring the resource requirements of production processes. But the ICT sector itself is unfortunately one of the fastest growing emitters of greenhouse gases and consumes a great deal of resources. Volkhard Beyer and Dirk Mayer, researchers at Fraunhofer IIS, show ways to optimize the life cycle assessment of IoT devices.