The must-attend event of the year for leaders and innovators across the entire chiplet ecosystem.
Meet us at booth 216 and attend our presentation with Cadence and Samsung on 21 January: Applying Digital Twin Technology to Chiplet Development.
Our researcher Andy Heinig, Head of the Chiplet Center of Excellence in Dresden, will moderate the session on Interfaces and Integrations on Wednesday, 22 January, 15:45 to 16:45 pm.
maintenance in Dortmund is the leading business platform for the maintenance sector. It is an established stage for innovations and trends and at the same time a top-class information centre for the entire industry.
The embedded world exhibition and conference offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to complex system design.