Reliability of ICs

In micro- and nanoelectronics, the miniaturization of structures (“More Moore”) and the heterointegration (“More than Moore”) are leading to ever more tightly packaged electronic systems. On one hand, this increases the potential spectrum of applications for the semiconductors. On the other hand, however, it also increases the impact of physical effects such as aging, variations or electrothermal interactions. In addition, the desire for greater computing performance and more extensive functionality in ICs often stands in contradiction to non-functional requirements concerning their reliability and robustness.

This can pose a major challenge to safety-critical applications in particular. After all, a long service life must be guaranteed for semiconductor-based systems in areas such as automotive or industrial electronics and medical technology, making it necessary to take this into account already during the IC design. We therefore supply methods and solutions at various levels of abstraction to help our partners achieve their individual requirements with regard to the robustness and reliability of their designs.

Our Services

We support you in the reliability assessment of electronic components with the following services:

  • Semiconductor characterization, in particular of degradation at wafer and package level in the low-voltage and high-voltage range (NBTI/PBTI, HCI; TDDB, GOI) 
  • Development of test concepts and qualification plans 
  • Implementation of customized measurement procedures 
  • Data acquisition / data analysis including lifetime prediction 
  • Calibration of transistor degradation models
  • Ageing modeling for transistors

Our Equipment for assessing the reliability of integrated transistors

  • Two wafer probers for single dies and wafers up to 12‘’, temperature range: -40 °C to 300 °C  
  • Two parameter analyzers and corresponding switch matrix for automated measurements
  • Two high-voltage source measurement units (HV-SMUs)
  • Package level reliability tester, temperature range: 25 °C to 200 °C

Added Value for You

Our expertise in the consideration of multi-physical problems as well as our support for diverse design environments make us your ideal partner for the design of robust and reliable ICs and systems.

  • Analysis and optimization of the impact of non-functional effects in IC and system design
  • Improved understanding as well as optimal utilization of technological capabilities without overdesign
  • Precise prediction as well as safeguarding of the lifespan of transistors, circuits and electronic components under specific application conditions
  • Satisfying quality requirements

References and More Information

Reference project

ADMONT

Combining expertise, technological platforms and existing clean rooms, a unique design center for »More-than-Moore-Technologien« is developed in Dresden.

Reference project

RESIST

Vehicle systems of all kinds are implemented today with the help of highly integrated semiconductors. The work within »RESIST« aims to make optimal use of nanoelectronics as a key to further advances.

Reference project

MoRV

The MoRV project aimed to develop software that ensures already during the IC design phase that the ICs developed will have the desired operating properties.

White Paper

Circuit Level Aging Simulations

How to minimize design margins with accurate advanced transistor degredation models.