News vom Fraunhofer IIS/EAS

Our Newsletter

Stay in touch and learn more about new developments, research projects or events of Fraunhofer IIS/EAS.

Information Sheets

Annual Report

A profile of the Fraunhofer Institute for Integrated Circuits IIS with numerous dates and facts as well as outstanding projects of a year.

 

Scientific Publications

Among others, you can find in the database »Fraunhofer-Publica« scientific publications, conference contributions and proceedings from the Fraunhofer institutes.

Current Press Releases (Selection)

 

Press Release / 31.3.2025

Major Advancement in Applied Research: FMD Launches the Chiplet Application Hub

On March 31, 2025, at the Hannover Messe, the Research Fab Microelectronics Germany officially unveiled its new Chiplet Application Hub

 

Press Release / 16.12.2024

APECS Pilot Line starts Operation in the Framework of the EU Chips Act

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semi-conductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act.

 

Press Release / Aug. 4, 2024

Paving the way for the semiconductor future: The Chiplet Center of Excellence commences operations

Three Fraunhofer Institutes have launched a forward-looking research initiative in Dresden: the Chiplet Center of Excellence (CCoE). Its purpose is to partner with industry to drive forward the introduction of chiplet technology.