Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS

Webinar: Chiplet integration

Webinar / October 30, 2024, 4:00 - 5:00 PM (CET)

Webinar Content

In this webinar, various integration technologies and concepts for chiplet structures of heterogeneous systems will be presented. The advantages and disadvantages of the different variants are discussed. Furthermore, the interaction between technology and design is shown.

Webinar language: English

Event details

Registration

Participation in our webinars is always free of charge.

Please register using the form below to receive the webinar link.

Costs

free of charge

Location

online

Date

October 30, 2024, 4:00 - 5:00 PM (CET)

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Language

English

Wed, October 30, 2024 (4:00 PM - 5:00 PM CET)

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Participation in our webinars is always free of charge.

We use the platform "Microsoft Teams" for their realization. After your registration for this webinar, you will receive an invitation from us by email in good time before the event. In this invitation you will find the link "Join Microsoft Teams meeting", which will redirect you to a web page. Here you can choose which way you want to participate in the webinar - either via the Windows app or alternatively without download and installation via your browser (Microsoft Edge or Google Chrome required).

Webinar date October 30, 2024, 4:00 PM - 5:00 PM CET (English)

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Contact

Contact Press / Media

Andy Heinig

Head of Department Efficient Electronics

Fraunhofer IIS, Division Engineering of Adaptive Systems EAS
Münchner Straße 16
01187 Dresden, Germany

Phone +49 351 45691-250

Send email
andy.heinig@eas.iis.fraunhofer.de

Contact Press / Media

Eileen Pfüller

Marketing Manager

Fraunhofer IIS, Division Engineering of Adaptive Systems EAS
Münchner Straße 16
01187 Dresden

Phone +49 351 45691-158

Send email
eileen.pfueller@eas.iis.fraunhofer.de