Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EASSanta Clara, USA / February 06, 2024 - February 08, 2024
Chiplet Summit Conference & Exhibition
The first annual Chiplet Summit addresses chip designers and provides knowledge and exchange on the topics of scalability, flexibility and performance with lower energy consumption of chiplets. The event focuses on networking with experts and providers. The chiplet expert at Fraunhofer IIS/EAS, Andy Heinig, shared the latest updates on packaging in several sessions and presented the topic of chiplets for the development of advanced driver assistance systems.