Events 2024: DTIP

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DTIP'2024 is the 26th edition of the Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS. The event aims to present the latest research in the field of design, test, integration and packaging of sensors, actuators, microsystems, MEMS, NEMS and MOEMS. All aspects such as design, modeling, testing, micromachining, integration and packaging of structures, devices and systems will be covered in a single conference track.