Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive SystemsSanta Clara, USA / January 21, 2025 - January 23, 2025
Chiplet Summit Conference & Exhibition
The must-attend event of the year for leaders and innovators across the entire chiplet ecosystem.
Meet us at booth 216 and attend our presentation with Cadence and Samsung on 21 January: Applying Digital Twin Technology to Chiplet Development.
Our researcher Andy Heinig, Head of the Chiplet Center of Excellence in Dresden, will moderate the session on Interfaces and Integrations on Wednesday, 22 January, 15:45 to 16:45 pm.